High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Resultados: 2.051
Seleccionar Imagen Número de referencia Fabr. Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad. Cant. RoHS Modelo ECAD Producto Número de posiciones Paso Número de filas Estilo de terminación Ángulo de montaje Altura de pila Valor de corriente Voltaje máximo Tasa de datos máxima Temperatura operativa mínima Temperatura operativa máxima Recubrimiento del contacto Material del contacto Material de la carcasa Serie Empaquetado
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 1.174En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 2.873En existencias
Mín.: 1
Múlt.: 1
Bobina: 250

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 400En existencias
Mín.: 1
Múlt.: 1
Bobina: 75

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 323En existencias
Mín.: 1
Múlt.: 1
Bobina: 50

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 860En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 1.428En existencias
Mín.: 1
Múlt.: 1
Bobina: 200

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 189En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 101En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 76En existencias
Mín.: 1
Múlt.: 1
Bobina: 125

Connectors 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 380En existencias
Mín.: 1
Múlt.: 1
Bobina: 550

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 410En existencias
Mín.: 1
Múlt.: 1
Bobina: 375

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 107En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 60En existencias
Mín.: 1
Múlt.: 1
Bobina: 75

Headers 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 186En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 212En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 115En existencias
Mín.: 1
Múlt.: 1
Bobina: 350

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 472En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 386En existencias
Mín.: 1
Múlt.: 1
Bobina: 200

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 396En existencias
Mín.: 1
Múlt.: 1
Bobina: 125

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 369En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 228En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Connectors 320 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 166En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 192En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Sockets 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 214En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 175En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape