High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Resultados: 2.051
Seleccionar Imagen Número de referencia Fabr. Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad. Cant. RoHS Modelo ECAD Producto Número de posiciones Paso Número de filas Estilo de terminación Ángulo de montaje Altura de pila Valor de corriente Voltaje máximo Tasa de datos máxima Temperatura operativa mínima Temperatura operativa máxima Recubrimiento del contacto Material del contacto Material de la carcasa Serie Empaquetado
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 1.206En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 1.436En existencias
Mín.: 1
Múlt.: 1
Bobina: 200

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 339En existencias
Mín.: 1
Múlt.: 1
Bobina: 50

Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 400En existencias
Mín.: 1
Múlt.: 1
Bobina: 75

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 3.143En existencias
Mín.: 1
Múlt.: 1
Bobina: 250

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 222En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 1.27MM SEARAY HS HD OPEN TERM 347En existencias
Mín.: 1
Múlt.: 1
Bobina: 200

Headers 150 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 117En existencias
Mín.: 1
Múlt.: 1
Bobina: 350

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 472En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 207En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 403En existencias
Mín.: 1
Múlt.: 1
Bobina: 200

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 100En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 82En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Connectors 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 43En existencias
Mín.: 1
Múlt.: 1
Bobina: 75

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 14 mm, 15 mm, 15.5 mm, 16.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 160En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Sockets 80 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 308En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Sockets 80 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 796En existencias
Mín.: 1
Múlt.: 1
Bobina: 375

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 172En existencias
Mín.: 1
Múlt.: 1
Bobina: 200

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 173En existencias
Mín.: 1
Múlt.: 1
Bobina: 250

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 48En existencias
Mín.: 1
Múlt.: 1
Bobina: 75

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 50En existencias
Mín.: 1
Múlt.: 1
Bobina: 50

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 139En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 781En existencias
Mín.: 1
Múlt.: 1
Bobina: 500

Sockets 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 91En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 311En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape