Amphenol FCI BergStak HS™ 0.5mm Mezzanine Connectors

Amphenol FCI BergStak HS™ 0.5mm Mezzanine Connectors are designed for high-speed and high-density parallel board-to-board applications and come in a variety of heights in different sizes. These connectors provide a flexible solution to meet 25Gbps and 32Gbps performance requirements. Additional features include scoop-proof housing, multiple plating, and PCB locator pegs. The series supports high-speed applications from PCIe® Gen 3, PCIe Gen 4, and PCIe Gen 5. Amphenol FCI BergStak HS™ 0.5mm Mezzanine Connectors are ideally used in datacom, telecom, server, storage, and embedded computer.

Features

Housing and terminal profile optimized to 25Gbps and 32Gbps
High density for electrical application needs
50 position sizes and 12mm stack height available
0.50mm double-row contact pitch conserves PCB space
Supports higher speed applications from PCIe Gen 3, PCIe Gen 4, and PCIe Gen 5

Extension of standard BergStak® 0.5mm
Scoop-proof feature housings prevent reverse mating
PCB locator pegs facilitate ease and accuracy during manual assembly
RoHS compliant and lead free

Applications

Datacom
Telecom
Servers

Storage
Embedded computers

Specifications

0.5A/contact current rating
Contact resistance
- Initial: 50mΩ max.
- After test: 70mΩ max.
Insulation resistance
- Initial: 100MΩ min.
- After test: 50MΩ min.
100MΩ minimum insulation resistance
50V_AC voltage rating

0.9N maximum/contact mating force
-40°C to 125°C operating temperature range
100 mating cycles durability
Material
- Housing: glass-filled LCP, UL 94V-0
- Contact base metal
  - Receptacle: copper alloy, high spring
  - Plug: copper alloy
- Solder area finish: matte pure tin over nickel