UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays

Samtec UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays are 0.635mm pitch high-density, high-speed signal/power arrays that achieve 64Gbps PAM4 speeds. These Samtech signal/power arrays feature rotated power blades for improved performance and simplified breakout region (BOR). These UDx6 AcceleRate MP series features 5mm and 10mm stack heights and up to 10 power and 240 signal positions. The signal/power arrays offer an open-pin-field design for routing and grounding flexibility. The series includes optional alignment pins, standard weld tabs for a secure connection to the board, and polarized guide posts for blind mating.

Resultados: 40
Seleccionar Imagen Número de referencia Fabr. Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad. Cant. RoHS Modelo ECAD Producto Número de posiciones Paso Número de filas Estilo de terminación Ángulo de montaje Valor de corriente Voltaje máximo Tasa de datos máxima Temperatura operativa mínima Temperatura operativa máxima Recubrimiento del contacto Material del contacto Material de la carcasa Frecuencia de datos Serie
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket 25En existencias
14,11 €
13,12 €
Mín.: 1
Múlt.: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Fecha prevista: 14/10/2026
12,76 €
11,53 €
11,25 €
Mín.: 1
Múlt.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Fecha prevista: 22/10/2026
14,26 €
13,26 €
Mín.: 1
Múlt.: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Fecha prevista: 21/10/2026
16,89 €
15,82 €
Mín.: 1
Múlt.: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 14/10/2026
10,04 €
9,00 €
8,50 €
8,32 €
Mín.: 1
Múlt.: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 22/10/2026
19,34 €
17,38 €
Mín.: 1
Múlt.: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 21/10/2026
10,79 €
9,68 €
9,13 €
8,97 €
Mín.: 1
Múlt.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 21/10/2026
20,32 €
18,29 €
Mín.: 1
Múlt.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 21/10/2026
11,06 €
9,94 €
9,69 €
Mín.: 1
Múlt.: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 22/10/2026
20,35 €
19,24 €
Mín.: 1
Múlt.: 1
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 12/10/2026
11,78 €
10,60 €
10,35 €
Mín.: 1
Múlt.: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 22/10/2026
21,29 €
20,15 €
Mín.: 1
Múlt.: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 21/10/2026
11,98 €
10,78 €
10,52 €
Mín.: 1
Múlt.: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 21/10/2026
24,63 €
23,48 €
Mín.: 1
Múlt.: 1
Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
22Fecha prevista: 21/10/2026
12,69 €
11,46 €
11,18 €
Mín.: 1
Múlt.: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 21/10/2026
25,56 €
24,40 €
Mín.: 1
Múlt.: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 22/10/2026
13,46 €
12,48 €
Mín.: 1
Múlt.: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 22/10/2026
14,16 €
13,17 €
Mín.: 1
Múlt.: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Fecha prevista: 14/10/2026
11,47 €
10,31 €
10,06 €
Mín.: 1
Múlt.: 1
Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Fecha prevista: 12/10/2026
15,40 €
14,38 €
Mín.: 1
Múlt.: 1
Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
22Fecha prevista: 11/11/2026
15,55 €
14,52 €
Mín.: 1
Múlt.: 1
Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
25Fecha prevista: 22/10/2026
18,16 €
17,08 €
Mín.: 1
Múlt.: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 22/10/2026
26,50 €
25,34 €
Mín.: 1
Múlt.: 1
Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
25Fecha prevista: 22/10/2026
27,59 €
26,43 €
Mín.: 1
Múlt.: 1
Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDM6
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket No en almacén Plazo producción 10 Semanas
11,82 €
Mín.: 350
Múlt.: 1
Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 64 Gb/s UDF6