Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.

Resultados: 6
Seleccionar Imagen Número de referencia Fabr. Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad. Cant. RoHS Modelo ECAD Producto Longitud Anchura Altura
Advanced Thermal Solutions Disipadores de calor Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x20mm 158En existencias
Mín.: 1
Múlt.: 1

Advanced Thermal Solutions Disipadores de calor Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm 352En existencias
Mín.: 1
Múlt.: 1

BGA Heat Sink 54 mm 68 mm 20 mm
Advanced Thermal Solutions Disipadores de calor maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x9.76mm 93En existencias
Mín.: 1
Múlt.: 1

Advanced Thermal Solutions Disipadores de calor maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x25mm 104En existencias
Mín.: 1
Múlt.: 1

Advanced Thermal Solutions Disipadores de calor Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x10mm 86En existencias
Mín.: 1
Múlt.: 1

Advanced Thermal Solutions Disipadores de calor Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x20mm 29En existencias
100Fecha prevista: 27/03/2026
Mín.: 1
Múlt.: 1