RISC-V Núcleo Módulos multiprotocolo

Resultados: 22
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Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad.
Cant. RoHS Modelo ECAD Serie
Frecuencia
Energía de salida
Tipo de interfaz
Tensión del suministro - Mín
Tensión del suministro - Máx
Temperatura operativa mínima
Temperatura operativa máxima
Tipo de conector de la antena
Dimensiones
Protocolo: Bluetooth, BLE (802.15.1)
Protocol: Wi-Fi (802.11)
Protocolo: ANT, Thread, Zigbee (802.15.4)
Empaquetado
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Hoja de datos
7En existencias
Mín.: 1
Múlt.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Hoja de datos
1En existencias
Mín.: 1
Múlt.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Espressif Systems Módulos multiprotocolo SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Hoja de datos
1.668En existencias
3.250Fecha prevista: 24/08/2026
Mín.: 1
Múlt.: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Espressif Systems Módulos multiprotocolo SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Hoja de datos
152En existencias
3.250Fecha prevista: 14/07/2026
Mín.: 1
Múlt.: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee)
Seeed Studio Módulos multiprotocolo XIAO ESP32S3 - 2.4GHz WiFi, BLE 5.0, Dual-Core, Battery Charge,Smart Homes, IoT, Wearable Devices, Robotics
Hoja de datos
3.217En existencias
Mín.: 1
Múlt.: 1

2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n
u-blox Módulos multiprotocolo ESP32-C6, 802.11ax+BLE, ant pin, open CPU, 4MB flash
Hoja de datos
500En existencias
Mín.: 1
Múlt.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Módulos multiprotocolo ESP32-C6, 802.11ax+BLE, ant pin, open CPU, 8MB flash
Hoja de datos
395En existencias
Mín.: 1
Múlt.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Módulos multiprotocolo ESP32-C6, 802.11ax+BLE, PCB ant, open CPU, 4MB flash
Hoja de datos
461En existencias
Mín.: 1
Múlt.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Módulos multiprotocolo ESP32-C6, 802.11ax+BLE, PCB ant, open CPU, 8MB flash
Hoja de datos
488En existencias
Mín.: 1
Múlt.: 1
: 500

2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Seeed Studio Módulos multiprotocolo Seeed Studio XIAO ESP32C3
2.333En existencias
Mín.: 1
Múlt.: 1

2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n
SparkFun Módulos multiprotocolo ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons
Hoja de datos
29En existencias
Mín.: 1
Múlt.: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
SparkFun Módulos multiprotocolo ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons
Hoja de datos
6En existencias
Mín.: 1
Múlt.: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
Espressif Systems Módulos multiprotocolo "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 640En existencias
5.850Pedido
Mín.: 1
Múlt.: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Espressif Systems Módulos multiprotocolo "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for
9.502Pedido
Mín.: 1
Múlt.: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Espressif Systems Módulos multiprotocolo ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6(802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules.
Hoja de datos
3.250Fecha prevista: 17/08/2026
Mín.: 1
Múlt.: 1

2.4 GHz, 5 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm Bluetooth WiFi Thread, Zigbee
Espressif Systems Módulos multiprotocolo "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for
1.948Fecha prevista: 21/07/2026
Mín.: 1
Múlt.: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
GigaDevice Módulos multiprotocolo RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
Hoja de datos
800Fecha prevista: 05/10/2026
Mín.: 1
Múlt.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice Módulos multiprotocolo RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
Hoja de datos
800Fecha prevista: 05/10/2026
Mín.: 1
Múlt.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
Seeed Studio Módulos multiprotocolo Seeed Studio XIAO ESP32-C6(Tape & Reel)
Hoja de datos
34Fecha prevista: 09/06/2026
Mín.: 1
Múlt.: 1

Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Hoja de datos
No en almacén Plazo producción 6 Semanas
Mín.: 1
Múlt.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Quectel Módulos multiprotocolo Wi-Fi 6, 2.4GHz, BLE5.2, RISC-V, ACK SDK for Matter, 4MB Flash, 512 KB SRAM, PCB antenna, -40C to 105C
Hoja de datos
No en almacén Plazo producción 12 Semanas
Mín.: 500
Múlt.: 250
: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax Reel
Quectel Módulos multiprotocolo No en almacén Plazo producción 5 Semanas
Mín.: 1
Múlt.: 1
2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax