High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Resultados: 2.051
Seleccionar Imagen Número de referencia Fabr. Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad. Cant. RoHS Modelo ECAD Producto Número de posiciones Paso Número de filas Estilo de terminación Ángulo de montaje Altura de pila Valor de corriente Voltaje máximo Tasa de datos máxima Temperatura operativa mínima Temperatura operativa máxima Recubrimiento del contacto Material del contacto Material de la carcasa Serie Empaquetado
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 175En existencias
Mín.: 1
Múlt.: 1
Bobina: 200
No
Connectors 200 Position 1.27 mm (0.05 in) 5 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 157En existencias
Mín.: 1
Múlt.: 1
Bobina: 325
No
Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 234En existencias
Mín.: 1
Múlt.: 1
Bobina: 200
No
Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 146En existencias
Mín.: 1
Múlt.: 1
Bobina: 125
No
Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 38En existencias
Mín.: 1
Múlt.: 1
Bobina: 50

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 50En existencias
Mín.: 1
Múlt.: 1
Bobina: 50

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 50En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 54En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 53En existencias
Mín.: 1
Múlt.: 1
Bobina: 200

Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket 65En existencias
Mín.: 1
Múlt.: 1
Bobina: 75

Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Socket 78En existencias
Mín.: 1
Múlt.: 1
Bobina: 700

Sockets 40 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 1.34 A 155 VAC, 219 VDC 64 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Terminal 48En existencias
Mín.: 1
Múlt.: 1
Bobina: 275
ADM6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Terminal 36En existencias
300Fecha prevista: 18/02/2026
Mín.: 1
Múlt.: 1
Bobina: 300
Connectors 70 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 61En existencias
Mín.: 1
Múlt.: 1
Bobina: 200
No
Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Socket 1.309En existencias
Mín.: 1
Múlt.: 1
Bobina: 700
Sockets 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 3.23 mm 1.34 A 155 VAC, 219 VDC 64 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Terminal 1.425En existencias
Mín.: 1
Múlt.: 1
Bobina: 675
Plugs 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 2.9 mm 1.34 A 155 VAC, 219 VDC 64 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Socket 553En existencias
Mín.: 1
Múlt.: 1
Bobina: 525
Sockets 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 7.23 mm 1.34 A 155 VAC, 219 VDC 64 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Socket 249En existencias
Mín.: 1
Múlt.: 1
Bobina: 700
Sockets 200 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 3.23 mm 1.34 A 155 VAC, 219 VDC 64 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Socket 173En existencias
Mín.: 1
Múlt.: 1
Bobina: 700
Sockets 280 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 3.23 mm 1.34 A 155 VAC, 219 VDC 64 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Socket 145En existencias
Mín.: 1
Múlt.: 1
Bobina: 700
ADF6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Socket 250En existencias
Mín.: 1
Múlt.: 1
Bobina: 700
ADF6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Terminal 250En existencias
Mín.: 1
Múlt.: 1
Bobina: 650
ADM6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Terminal 587En existencias
Mín.: 1
Múlt.: 1
Bobina: 675
ADM6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Terminal 184En existencias
Mín.: 1
Múlt.: 1
Bobina: 875
Plugs 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 2.9 mm 1.34 A 155 VAC, 219 VDC 64 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.635 mm AcceleRate HD High-Density 4-Row Terminal 892En existencias
Mín.: 1
Múlt.: 1
Bobina: 875
Plugs 200 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 2.9 mm 1.34 A 155 VAC, 219 VDC 64 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape