High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Resultados: 2.051
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 Fabr.
Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad.
Cant. RoHS Modelo ECAD Producto
Número de posiciones
Paso
Número de filas
Estilo de terminación
Ángulo de montaje
Altura de pila
Valor de corriente
Voltaje máximo
Tasa de datos máxima
Temperatura operativa mínima
Temperatura operativa máxima
Recubrimiento del contacto
Material del contacto
Material de la carcasa
Serie
Empaquetado
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
78En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
33En existencias
300Fecha prevista: 03/03/2026
Mín.: 1
Múlt.: 1
Bobina: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
46En existencias
Mín.: 1
Múlt.: 1
Bobina: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Hoja de datos
262En existencias
Mín.: 1
Múlt.: 1
Bobina: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
128En existencias
Mín.: 1
Múlt.: 1
Bobina: 125

Connectors 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
70En existencias
Mín.: 1
Múlt.: 1
Bobina: 125

Connectors 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
86En existencias
Mín.: 1
Múlt.: 1
Bobina: 125

Connectors 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
89En existencias
125Fecha prevista: 04/03/2026
Mín.: 1
Múlt.: 1
Bobina: 125

Connectors 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
169En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Connectors 400 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050" SEARAY High-Speed High-Density Open-Pin-Field Array Socket, 30 Pos, 4 Row
Hoja de datos
2En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
120En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Connectors 200 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
207En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Headers 40 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
103En existencias
MouseReel Disponible
Mín.: 1
Múlt.: 1
Bobina: 175

Sockets 80 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape, MouseReel
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
23En existencias
MouseReel Disponible
Mín.: 1
Múlt.: 1
Bobina: 225

Sockets 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape, MouseReel
Samtec Conectores placa a placa y mezzanine 1.27MM SEARAY HS HD OPN ARRAY
Hoja de datos
67En existencias
Mín.: 1
Múlt.: 1
Bobina: 200

Sockets 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
90En existencias
200Fecha prevista: 06/04/2026
Mín.: 1
Múlt.: 1
Bobina: 200

Sockets 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
27En existencias
250Fecha prevista: 06/04/2026
Mín.: 1
Múlt.: 1
Bobina: 250

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
133En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
115En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
30En existencias
Mín.: 1
Múlt.: 1
Bobina: 75

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
40En existencias
Mín.: 1
Múlt.: 1
Bobina: 75

Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
16En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
75En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Sockets 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
41En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
23En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape