High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

Resultados: 2.051
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 Fabr.
Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad.
Cant. RoHS Modelo ECAD Producto
Número de posiciones
Paso
Número de filas
Estilo de terminación
Ángulo de montaje
Altura de pila
Valor de corriente
Voltaje máximo
Tasa de datos máxima
Temperatura operativa mínima
Temperatura operativa máxima
Recubrimiento del contacto
Material del contacto
Material de la carcasa
Serie
Empaquetado
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
235En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
124En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
369En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
183En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
61En existencias
Mín.: 1
Múlt.: 1
Bobina: 200

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
233En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
39En existencias
Mín.: 1
Múlt.: 1
Bobina: 125

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
143En existencias
Mín.: 1
Múlt.: 1
Bobina: 75

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
200En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
200En existencias
Mín.: 1
Múlt.: 1
Bobina: 75

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 16 mm, 17 mm, 17.5 mm, 18.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
183En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Plugs 40 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 220 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
615En existencias
Mín.: 1
Múlt.: 1
Bobina: 650

Plugs 40 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
330En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Plugs 40 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
160En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Plugs 100 Position 0.8 mm (0.031 in) 10 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
322En existencias
Mín.: 1
Múlt.: 1
Bobina: 375

Plugs 160 Position 0.8 mm (0.031 in) 8 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
152En existencias
Mín.: 1
Múlt.: 1
Bobina: 375

Plugs 160 Position 0.8 mm (0.031 in) 8 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
680En existencias
Mín.: 1
Múlt.: 1
Bobina: 275

Plugs 80 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
198En existencias
Mín.: 1
Múlt.: 1
Bobina: 250

Plugs 160 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
180En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Plugs 320 Position 0.8 mm (0.031 in) 8 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
157En existencias
Mín.: 1
Múlt.: 1
Bobina: 175

Plugs 400 Position 0.8 mm (0.031 in) 10 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
88En existencias
Mín.: 1
Múlt.: 1
Bobina: 225

Plugs 500 Position 0.8 mm (0.031 in) 10 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
417En existencias
Mín.: 1
Múlt.: 1
Bobina: 475

Plugs 200 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
94En existencias
Mín.: 1
Múlt.: 1
Bobina: 375

Plugs 300 Position 0.8 mm (0.031 in) 6 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
61En existencias
Mín.: 1
Múlt.: 1
Bobina: 350

Plugs 400 Position 0.8 mm (0.031 in) 8 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
240En existencias
Mín.: 1
Múlt.: 1
Bobina: 275

Plugs 200 Position 0.8 mm (0.031 in) 4 Row Solder Straight 1.3 A 56 Gbps Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM8 Reel, Cut Tape