TE Connectivity Z-PACK HM-Zd Plus Connectors

TE Connectivity's (TE) Z-PACK HM-Zd Plus Connectors update the daughter connections to enhance performance, resulting in lower cross talk. This is achieved through the incorporation of added ground contacts on the outside pair of the receptacle connector system. This connector system performs at 15Gbp/s with a migration plan to 20Gbp/s. The daughter card connector remains compatible with existing Z-PACK HM-Zd backplane connectors. TE Z-PACK HM-Zd Plus Connectors are well-suited for advanced TCA next-generation applications and specified for advanced TCA zone 2 requirements.

Features

  • Enables field speed upgrades using the Z-PACK HM-Zd plus receptacles plugged into existing Z-PACK HM-Zd backplane connectors
  • Smaller PTH size of 0.46mm
  • Integrated pre-alignment features and polarization built into the mating interface for a robust mating design
  • Supports data rates up to 15Gbp/s with a migration plan to 20Gbp/s
  • Standard module size of 25mm (0.984")
  • Card pitch is 20.32mm (0.8") for 2-pair headers and 25.40mm (1") for 4-pair headers
  • Compatible with existing Z-PACK HM-Zd backplane connectors

Applications

  • Servers
  • Routers
  • Storage equipment
  • Test and measurement equipment
  • Medical diagnostic equipment
  • Advanced TCA next-generation applications
Publicado: 2012-03-12 | Actualizado: 2022-03-11