iWave Global FPGA Heat Sinks for SOMs
iWave Global FPGA Heat Sinks for SOMs are designed for the FPGA SOMs Arria10 and Zynq Ultrascale+ MPSOC. The FPGA Heat Sinks are available in a 95mm x 75mm package made up of aluminum material. The devices have a silicone elastomer as a thermal gap pad between the CPU and the heat sink. The rugged and lightweight heat sinks can be easily attached to the modules with the iWave’s FPGA system.
Features
- 95mm x 75mm package
- Aluminum material
- Silicone elastomer as a thermal gap pad
- Rugged and lightweight
Applications
- Arria10 FPGA SOM
- Zynq Ultrascale+ MPSOC FPGA SOM
Zynq Ultrascale+ Package
Arria10 Package
Publicado: 2020-03-30
| Actualizado: 2026-01-22