Amphenol Aerospace High Density HDB³ and HSB³ Connectors
Amphenol Aerospace High Density HDB³ and HSB³ Connectors incorporate a higher density contact pattern and lower mated height than Amphenol's standard low mating force rectangular brush connectors. HDB³ connectors utilize the same durable and reliable B³ brush contact in a tighter 0.070" x 0.060" staggered grid pattern. The HSB³ series allows data rates up to 6.250Gb/s via 100Ω matched impedance differential pairs. Applications for Amphenol Aerospace High Density HDB³ and HSB³ Connectors are transportation, medical equipment, military and commercial avionics, C4ISR, UAVs, naval, high-definition cameras, and harsh environments.
Features
- Higher density contact pattern
- Uses less board space
- Allows for shorter mated height
- Provides the durability and performance of the brush contact
Applications
- Transportation
- Medical equipment
- Military and commercial avionics
- C4ISR
- UAVs
- Naval
- High-definition cameras
- Harsh environments
Specifications
- Polarization: D-shaped design
- Up to 6.25Gbps HDB³ data rates
- Optional keys offer 36 unique keying combinations
- Optional guide pins provide additional alignment
- Capable of correcting up to a 020" initial radial misalignment
- Capable of mating with up to a 2° initial angular misalignment
- 100,000 mating cycles
- 1.5oz insertion/extraction force typical per contact
- -65°C to +125°C operating temperature range
- Current rating: 2A hot-swap 1A maximum (load dependent)
- 5GΩ minimum insulation resistance
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High-performance interconnect systems for a broad range of industrial applications.
Publicado: 2015-02-26
| Actualizado: 2022-06-22