Alliance Memory AS4C32M16MS / AS4C16M32MS 512M Low Power Mobile SDRAMs

Alliance Memory AS4C32M16MS / AS4C16M32MS
512M Low Power Mobile SDRAMs

Alliance Memory AS4C32M16MS / AS4C16M32MS 512M Low Power Mobile SDRAMs (MSDR) are high-speed CMOS double data rate two synchronous DRAMs. The AS4C32M16MS / AS4C16M32MS are four bank Synchronous DRAMs organized as 4 banks x 8Mbit x 16 and 4 banks x 4Mbit x 32.

The AS4C32M16MS / AS4C16M32MS achieve 166MHz high-speed data transfer rates up by employing a chip architecture. The chip architecture prefetches multiple bits and then synchronizes the output data to a system clock. All of the control, address, data input, and output circuits are synchronized with the positive edge of an externally supplied clock.

Features
  • 4 banks x 8Mbit x 16 organization
  • 4 banks x 4Mbit x 32 organization
  • Full Synchronous Dynamic RAM, with all signals referenced to clock rising edge
  • Single Pulsed RAS Interface
  • Data Mask for Read/Write Control
  • Four Banks controlled by BA0 & BA1
  • Programmable CAS Latency: 2, 3
  • Programmable Wrap Sequence: Sequential or Interleave 
  • Programmable Burst Length: 1, 2, 4, 8, Full page for Sequential Type 1, 2, 4, 8 for Interleave Type
  • Multiple Burst Read with Single Write Operation
  • Automatic and Controlled Precharge Command
  • Random Column Address every CLK (1-N Rule)

  • Power Down Mode and Clock Suspend Mode
  • Auto Refresh and Self Refresh
  • Refresh Interval: 8192 cycles/64ms 
  • Available in 54-ball (32M x16) and 90-ball (16M x32) FBGA 
  • VDD=1.8V, VDDQ=1.8V
  • LVTTL Interface
  • Drive Strength (DS) Option: Full, 1/2, 1/4 and 3/4
  • Auto Temperature Compensated Self Refresh (Auto TCSR) 
  • Partial Array Self Refresh (PASR) option: Full, 1/ 2, 1/4, 1/8 and 1/16
  • Deep Power Down (DPD) mode
  • Programmable Power Reduction Feature by patial array activation during Self-Refresh
  • Operating Temperature Range Commercial (-25°C to 85°C) Industrial (-40°C to +85°C)

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Publicado: 2017-03-31 | Actualizado: 2017-03-31