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Infineon Technologies DF4-19MR20W3M1HF_B11 EasyPACK™ Module

Infineon Technologies DF4-19MR20W3M1HF_B11 EasyPACK™ Module is configured with the operation of the CoolSiC™ trench MOSFETs and PressFIT/NTC. The DF4-19MR20W3M1HF_B11 offers high current density and a low inductive design. The modules implement PressFIT contact technology and integrate an NTC temperature sensor.

The Infineon DF4-19MR20W3M1HF_B11 EasyPACK Module is qualified for industrial and solar applications.

Features

  • Electrical features
    • VDSS = 2000V
    • IDN = 60A / IDRM = 120A
    • High current density
    • Low inductive design
  • Mechanical features
    • Rugged mounting due to integrated mounting clamps
    • PressFIT contact technology
    • Integrated NTC temperature sensor

Applications

  • Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068
  • Solar applications

Circuit Diagram

Application Circuit Diagram - Infineon Technologies DF4-19MR20W3M1HF_B11 EasyPACK™ Module

Package Outline

Mechanical Drawing - Infineon Technologies DF4-19MR20W3M1HF_B11 EasyPACK™ Module
Publicado: 2022-10-20 | Actualizado: 2022-12-29