Módulos multiprotocolo

Resultados: 456
Seleccionar Imagen Número de referencia Fabr. Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad. Cant. RoHS Modelo ECAD Serie Frecuencia Energía de salida Tipo de interfaz Tensión del suministro - Mín Tensión del suministro - Máx Temperatura operativa mínima Temperatura operativa máxima Tipo de conector de la antena Dimensiones Protocolo: Bluetooth, BLE (802.15.1) Protocolo: Telefonía móvil, NBIoT y LTE Protocolo: GPS y GLONASS Protocolo: Sub GHz Protocol: Wi-Fi (802.11) Protocolo: ANT, Thread, Zigbee (802.15.4) Empaquetado
GigaDevice Módulos multiprotocolo RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
800Fecha prevista: 20/11/2026
Mín.: 1
Múlt.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice Módulos multiprotocolo RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
800Fecha prevista: 01/01/2027
Mín.: 1
Múlt.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice Módulos multiprotocolo RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
800Fecha prevista: 01/01/2027
Mín.: 1
Múlt.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
u-blox Módulos multiprotocolo RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
495Fecha prevista: 18/01/2027
Mín.: 1
Múlt.: 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
u-blox Módulos multiprotocolo Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
250Fecha prevista: 12/10/2026
Mín.: 1
Múlt.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Módulos multiprotocolo Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
750Fecha prevista: 31/12/2026
Mín.: 1
Múlt.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Módulos multiprotocolo M.2 Type 2230 Key E card with MAYA-W472 Wi-Fi 6 Dual-Band, Bluetooth 5.4, 802.15.4 module
140Fecha prevista: 01/02/2027
Mín.: 1
Múlt.: 1

MAYA-W4 2.405 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Tray
u-blox Módulos multiprotocolo IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
958Pedido
Mín.: 1
Múlt.: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape, MouseReel
u-blox Módulos multiprotocolo Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
500Fecha prevista: 31/12/2026
Mín.: 1
Múlt.: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox Módulos multiprotocolo Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, 2 ant pins
1.000Fecha prevista: 01/02/2027
Mín.: 1
Múlt.: 1
: 500

MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
u-blox Módulos multiprotocolo Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, U.FL conn, NXP610
1.000Fecha prevista: 01/02/2027
Mín.: 1
Múlt.: 1
: 500

MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
u-blox Módulos multiprotocolo Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, embedded antenna
1.000Fecha prevista: 01/02/2027
Mín.: 1
Múlt.: 1
: 500

MAYA-W4 2.402 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
Texas Instruments Módulos multiprotocolo SimpleLink multipro tocol 2.4-GHz wirele
1.900Fecha prevista: 15/09/2026
Mín.: 1
Múlt.: 1
: 2.000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Texas Instruments Módulos multiprotocolo SimpleLink multipro tocol 2.4-GHz wirele
1.968Fecha prevista: 09/09/2026
Mín.: 1
Múlt.: 1
: 2.000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs Módulos multiprotocolo Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
1.469Pedido
Mín.: 1
Múlt.: 1

MGM210P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
998Fecha prevista: 15/09/2026
Mín.: 1
Múlt.: 1
: 1.000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1.000Fecha prevista: 23/10/2026
Mín.: 1
Múlt.: 1
: 1.000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1.000Fecha prevista: 09/09/2026
Mín.: 1
Múlt.: 1
: 1.000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Módulos multiprotocolo SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
200Pedido
Mín.: 1
Múlt.: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Microchip Technology Módulos multiprotocolo Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
144Fecha prevista: 24/09/2026
Mín.: 1
Múlt.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
300Fecha prevista: 15/09/2026
Mín.: 1
Múlt.: 1

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Módulos multiprotocolo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
200Fecha prevista: 04/09/2026
Mín.: 1
Múlt.: 1

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
NXP Semiconductors Módulos multiprotocolo IW610BHN/A1ZDI
25Fecha prevista: 29/10/2026
Mín.: 1
Múlt.: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Módulos multiprotocolo IW610CHN/A1ZDI
25Fecha prevista: 29/10/2026
Mín.: 1
Múlt.: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors Módulos multiprotocolo IW610FHN/A1ZDI
25Fecha prevista: 29/10/2026
Mín.: 1
Múlt.: 1
: 2.700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape