+ 85 C Tray Multiprotocol Modules

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
Insight SiP Multiprotocol Modules nRF52832 LoRa Transceiver & BLE 5 Module EU
Datasheet
1.222On Order
Min.: 1
Mult.: 1
ISP4520 863 MHz to 870 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0 Tray
u-blox Multiprotocol Modules M.2 card with JODY-W377, in tray
Datasheet
1.006On Order
Min.: 1
Mult.: 1
Max.: 100

JODY-W3 2.4 GHz, 5 GHz 19 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.3 Tray
Ezurio Multiprotocol Modules 60 Series, Sterling Module w/u.FL, SDIO/UART
Datasheet
400On Order
Min.: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Telit Cinterion Multiprotocol Modules
540On Order
Min.: 1
Mult.: 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Ezurio Multiprotocol Modules 60 Series, Sterling Module w/u.FL, USB/UART
Datasheet
150Expected 2/8/2027
Min.: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Kaga FEI Multiprotocol Modules WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
Datasheet
300Expected 11/17/2026
Min.: 1
Mult.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI Multiprotocol Modules WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
Datasheet
300Expected 11/17/2026
Min.: 1
Mult.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
u-blox Multiprotocol Modules M.2 Type 2230 Key E card with MAYA-W472 Wi-Fi 6 Dual-Band, Bluetooth 5.4, 802.15.4 module
140Expected 12/25/2026
Min.: 1
Mult.: 1

MAYA-W4 2.405 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Tray
Telit Cinterion Multiprotocol Modules
387Expected 8/27/2026
Min.: 1
Mult.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm NBIoT, LTE GPS, GLONASS Tray
Silicon Labs Multiprotocol Modules 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
Datasheet
517Expected 9/11/2026
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n Tray
Silicon Labs Multiprotocol Modules 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
Datasheet
786On Order
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 3 V 3.63 V - 40 C + 85 C External 9.1 mm x 9.8 mm x 1.6 mm Bluetooth 5.0 Tray
u-blox Multiprotocol Modules M.2 card with JODY-W377, single package
Datasheet
15Expected 12/31/2026
Min.: 1
Mult.: 1

JODY-W3 2.4 GHz, 5 GHz 16 dBm, 19 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
Ezurio Multiprotocol Modules Module, Sterling LWB+, M.2, Key E, SDIO, UART
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 900
Mult.: 900

Sterling-LWB+ 2.4 GHz USART 3.2 V 4.8 V - 40 C + 85 C MHF4 Bluetooth 5.2 WiFi 4, 802.11 b/g/n Tray
Inventek Multiprotocol Modules 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/CIC/CE
Datasheet

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Inventek Multiprotocol Modules 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. U.FL for External Antenna. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE
Datasheet

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C u.FL 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Inventek Multiprotocol Modules 802.11 b/g/n WiFi and BT 4.2 combo and STM32F412 WICED Module with Chip Antenna. Certified FCC/IC/CE
Datasheet
Non-Stocked
Min.: 980
Mult.: 196

2.4 GHz 17 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C Chip 14.5 mm x 34 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Insight SiP Multiprotocol Modules ISP3010-UX nRF52832 BLE 5 Module
Datasheet
Non-Stocked
Min.: 50
Mult.: 50
2.4 GHz 4 dBm SPI 1.8 V 6 V - 30 C + 85 C Built-In 14 mm x 14 mm x 1.5 mm Bluetooth 5.0 Tray
u-blox Multiprotocol Modules M.2 card with JODY-W377, in tray, SDIO interface
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

2.5 GHz, 5 GHz 16 dBm, 19 dBm I2S, UART 3.135 V 3.465 V - 40 C + 85 C u.FL 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module,u.FL Antenna
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 144
Mult.: 72

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna
Datasheet
Lead-Time 20 Weeks
Min.: 1
Mult.: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Silicon Labs Multiprotocol Modules Silicon Laboratories Non-Stocked
Min.: 105
Mult.: 105

AMW004 2.412 GHz to 2.484 GHz 19 dBm I2C, SPI, UART 1.62 V 3.6 V - 30 C + 85 C 17.8 mm x 31.8 mm x 3.1 mm BLE 802.11 b/d/e/g/h/i/j/n Tray
Silicon Labs Multiprotocol Modules MGM13S02F512GA Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1.885
Mult.: 1.885

MGM13S 2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Built-In 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
Silicon Labs Multiprotocol Modules MGM13S12F512GA Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connec
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1.885
Mult.: 1.885

MGM13S 2.4 GHz 19 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Built-In 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
Silicon Labs Multiprotocol Modules MGM13S12F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1.885
Mult.: 1.885

MGM13S 2.4 GHz I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C 6.5 mm x 6.5 mm x 1.4 mm Tray