SLIMDIP™ Modules

Mitsubishi Electric SLIMDIP™ Modules are offered in an ultra-small, compact, transfer mold package that contributes to downsizing and weight reduction of inverter systems for home appliances. The SLIMDIP series integrates a reverse conducting IGBT (RC-IGBT) that applies the 7th-generation technology as a power chip. With integrated power chips, drive, and protection circuits, the SLIMDIP devices are ideal for AC 100V-240V class low-power motor inverter control. Mitsubishi Electric SLIMDIP Modules feature a transfer-molded structure that incorporates a high thermal conductivity insulation sheet, providing heat. The SLIMDIP lineup includes the SLIMDIP-L and SLIMDIP-S.

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Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad.
Cant. RoHS Modelo ECAD Tipo
Voltaje de saturación colector-emisor
Corriente continua del colector a 25 C
Voltaje colector-emisor VCEO máx.
Estilo de montaje
Tecnología
Temperatura operativa mínima
Temperatura operativa máxima
Mitsubishi Electric Módulos de potencia inteligentes - IPM SLIMDIP IPM 6-PAC
Hoja de datos
3-Phase IGBT Inverter 600 V 0.416666667 600 V Through Hole Si - 30 C + 150 C
Mitsubishi Electric Módulos de potencia inteligentes - IPM SLIMDIP IPM 6-PAC
Hoja de datos
3-Phase IGBT Inverter 600 V 15 A 600 V Through Hole Si - 30 C + 150 C
Mitsubishi Electric Módulos de potencia inteligentes - IPM SLIMDIP IPM 6-PAC
Hoja de datos
3-Phase IGBT Inverter 600 V 0.208333333 600 V Through Hole Si - 30 C + 150 C
Mitsubishi Electric Módulos de potencia inteligentes - IPM SLIMDIP IPM 6-PAC
Hoja de datos
3-Phase IGBT Inverter 600 V 15 A 600 V Through Hole Si - 30 C + 150 C


Mitsubishi Electric Módulos de potencia inteligentes - IPM SLIMDIP IPM 6-PAC
Hoja de datos
Más información disponible
3-Phase IGBT Inverter 600 V 20 A 600 V Through Hole Si - 30 C + 150 C
Mitsubishi Electric Módulos de potencia inteligentes - IPM SLIMDIP IPM 6-PAC
Hoja de datos
600 V 30 A 600 V Through Hole Si - 30 C + 150 C