Computer Cables Cable for LVDS Panel with JST SHDR-40V connector, 50 cm, Open End, matches also with conga-JC370.

CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TC675 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded.

Computer-On-Modules - COM COM HPC Size A module with Intel Core i3-1115GRE Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.

Heat Sinks Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0

Heat Sinks Standard Heat spreader for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole

Computer-On-Modules - COM JUMPtec HSP COMe-cWL6 Cu-core through

Computer-On-Modules - COM JUMPtec COMe-mBTc10 E3815 1GB/2S

Development Boards & Kits - x86 EVALUATION CARRIER BRD COM EXP TYPE 10

Computer-On-Modules - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor

Computer-On-Modules - COM COM-HPC Mini module based on Intel Core i7-1370PRE processor with 6 P-cores 1.9GHz up to 4.8GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 24MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor

Computer-On-Modules - COM JUMPtec COMe-mEL10 E2 x6212RE 4G/16G