200-LPAM Conectores placa a placa y mezzanine

Resultados: 115
Seleccionar Imagen Número de referencia Fabr. Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad. Cant. RoHS Modelo ECAD Producto Número de posiciones Paso Número de filas Estilo de terminación Ángulo de montaje Altura de pila Valor de corriente Voltaje máximo Tasa de datos máxima Temperatura operativa mínima Temperatura operativa máxima Recubrimiento del contacto Material del contacto Material de la carcasa Serie Empaquetado
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 168En existencias
Mín.: 1
Múlt.: 1
: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 447En existencias
Mín.: 1
Múlt.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 139En existencias
Mín.: 1
Múlt.: 1
: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 343En existencias
Mín.: 1
Múlt.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 380En existencias
Mín.: 1
Múlt.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 120En existencias
Mín.: 1
Múlt.: 1
: 450

Headers 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 633En existencias
Mín.: 1
Múlt.: 1
: 625

Headers 40 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 162En existencias
Mín.: 1
Múlt.: 1
: 325

LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 175En existencias
Mín.: 1
Múlt.: 1
: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 321En existencias
Mín.: 1
Múlt.: 1
: 300

Headers 400 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec LPAM-30-01.0-S-06-1-K-TR
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 275En existencias
Mín.: 1
Múlt.: 1
: 325
LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 18En existencias
Mín.: 1
Múlt.: 1
: 450

Headers 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array No en almacén Plazo producción 3 Semanas
Mín.: 300
Múlt.: 300
: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 232En existencias
Mín.: 1
Múlt.: 1
: 300

LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 199En existencias
Mín.: 1
Múlt.: 1
: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 203En existencias
Mín.: 1
Múlt.: 1
: 475

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 160En existencias
Mín.: 1
Múlt.: 1
: 475

Plugs 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 607En existencias
Mín.: 1
Múlt.: 1
: 300

LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 191En existencias
Mín.: 1
Múlt.: 1
: 300

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 293En existencias
Mín.: 1
Múlt.: 1
: 325

Headers 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 2En existencias
Mín.: 1
Múlt.: 1
: 300

Headers 160 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 353En existencias
Mín.: 1
Múlt.: 1
: 475

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 18En existencias
Mín.: 1
Múlt.: 1
: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
258Fecha prevista: 09/11/2026
Mín.: 1
Múlt.: 1
: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array No en almacén Plazo producción 4 Semanas
Mín.: 450
Múlt.: 450
: 450

LPAM Reel