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On-Chip Liquid Cooling for AI Servers

Wakefield Thermal On-Chip Liquid Cold Plate supports Intel Xeon^® processors and provides direct liquid cooling for high-power server CPUs in AI, high-performance computing (HPC), and hyperscale data center environments. The solution targets Intel Eagle Stream platforms and supports 4th and 5th Gen Intel Xeon Scalable processors, helping manage demanding thermal loads in dense compute racks. This cold plate uses an aluminum body with nickel plating and a vacuum-brazed construction. The design supports CPUs with up to 700W TDP and delivers 0.0267°C/W thermal resistance under the listed test conditions, enabling sustained performance when air cooling may limit rack density. Wakefield Thermal On-Chip Liquid Cold Plate uses Ø10mm OD hose-barb inlet and outlet ports, Intel version 2 EGS fasteners, and 50/50 coolant. The cold plate operates over a recommended temperature range of -40°C to +100 °C.