Renesas Electronics Dispositivos de RF e inalámbricos

Bucles de enganche de fase (PLL) XUH7 APXOXXX

Bucles de enganche de fase (PLL) XUH7 APXOXXX

Bucles de enganche de fase (PLL) XUH7 APXOXXX

Bucles de enganche de fase (PLL) XUL5 APXOXXX

Sistemas RF en un chip (SoC) Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, PMU, memories and peripherals ? 12 GPIOsin WL-CSP34 and 0.4mm ball pitch package

Sistemas RF en un chip (SoC) Bluetooth Low Energy 4.2 SoC with Flexpower ARM Cortex M0, crypto, PMU, memories and peripherals - 37 GPIOs in AQFN60 package and 0.55mm pin pitch

Sistemas RF en un chip (SoC) Bluetooth Low Energy 5.0 SoC with integrated ARM Cortex M0, PMU, memories, voice interface and peripherals, 105degC ? 25 GPIOsin QFN40 and 0.4mm pin pitch package

Sistemas RF en un chip (SoC) Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package

Sistemas RF en un chip (SoC) Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package

Sistemas RF en un chip (SoC) Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

Herramientas de desarrollo Bluetooth - 802.15.1 Bluetooth Low Energy DA14706 daughter board

Herramientas de desarrollo Wi-Fi - 802.11 CHGS Wi-Fi 6/6E 2T2R + BT-Tri-Band LGA Module