5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.

Resultados: 4.277
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Descripción Hoja de datos Disponibilidad Precio (EUR) Filtre los resultados de la tabla por precio unitario basándose en su cantidad.
Cant. RoHS Modelo ECAD Producto
Número de posiciones
Paso
Número de filas
Estilo de terminación
Ángulo de montaje
Altura de pila
Valor de corriente
Voltaje máximo
Tasa de datos máxima
Temperatura operativa mínima
Temperatura operativa máxima
Recubrimiento del contacto
Material del contacto
Material de la carcasa
Serie
Empaquetado
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
519En existencias
Mín.: 1
Múlt.: 1
Bobina: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
178En existencias
Mín.: 1
Múlt.: 1
Bobina: 375

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
312En existencias
Mín.: 1
Múlt.: 1
Bobina: 400

Headers 40 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 11 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
360En existencias
Mín.: 1
Múlt.: 1
Bobina: 375

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
112En existencias
Mín.: 1
Múlt.: 1
Bobina: 125

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
175En existencias
Mín.: 1
Múlt.: 1
Bobina: 200
No
Connectors 200 Position 1.27 mm (0.05 in) 5 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
88En existencias
Mín.: 1
Múlt.: 1
Bobina: 200
No
Sockets 300 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine
Hoja de datos
278En existencias
Mín.: 1
Múlt.: 1
Bobina: 350
No
Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
292En existencias
Mín.: 1
Múlt.: 1
Bobina: 325
No
Sockets 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
87En existencias
Mín.: 1
Múlt.: 1
Bobina: 275
No
Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
239En existencias
Mín.: 1
Múlt.: 1
Bobina: 325
No
Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
370En existencias
Mín.: 1
Múlt.: 1
Bobina: 200
No
Sockets 500 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
81En existencias
Mín.: 1
Múlt.: 1
Bobina: 250
No
Sockets 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
234En existencias
Mín.: 1
Múlt.: 1
Bobina: 200
No
Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
146En existencias
Mín.: 1
Múlt.: 1
Bobina: 125
No
Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
149En existencias
Mín.: 1
Múlt.: 1
Bobina: 300
No
Sockets 200 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
193En existencias
Mín.: 1
Múlt.: 1
Bobina: 375
No
Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
328En existencias
Mín.: 1
Múlt.: 1
Bobina: 475
No
Connectors 40 Position 1.27 mm (0.05 in) 4 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
272En existencias
Mín.: 1
Múlt.: 1
Bobina: 225
No
Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
200En existencias
Mín.: 1
Múlt.: 1
Bobina: 250
No
Sockets 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
106En existencias
MouseReel Disponible
Mín.: 1
Múlt.: 1
Bobina: 225
No
Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape, MouseReel
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
185En existencias
Mín.: 1
Múlt.: 1
Bobina: 225
Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
139En existencias
Mín.: 1
Múlt.: 1
Bobina: 350
No
Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 9.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Hoja de datos
53En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Connectors 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Conectores placa a placa y mezzanine .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Hoja de datos
50En existencias
Mín.: 1
Múlt.: 1
Bobina: 100

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape