9703-4X10

3M Electronic Specialty
517-9703-4X10
9703-4X10

Fabr.:

Descripción:
Cintas adhesivas Electrically Conductive Adhesive Transfer Tape 4 in x 10yd Roll

En existencias: 17

Existencias:
17
Puede enviarse inmediatamente
Pedido:
33
Fecha prevista: 09/03/2026
Plazo de producción de fábrica:
8
Semanas Tiempo estimado para la producción en fábrica para cantidades superiores a las mostradas.
Mínimo: 1   Múltiples: 1
Precio unitario:
-,-- €
Precio total:
-,-- €
Tarifa estimada:
Este producto se envía de forma GRATUITA

Precio (EUR)

Cant. Precio unitario
Precio total
234,66 € 234,66 €
206,50 € 2.478,00 €
197,40 € 5.329,80 €
192,30 € 9.807,30 €
102 Cotización

Atributo del producto Valor del atributo Seleccionar atributo
3M
Categoría de producto: Cintas adhesivas
RoHS:  
Tapes
Conductive
Electrically Conductive Adhesive Transfer Tape
Acrylic
4 in
101.6 mm
10 yd
9.14 m
Marca: 3M Electronic Specialty
Tipo de producto: Adhesive Tapes
Serie: 9703
Cantidad del paquete de fábrica: 3
Subcategoría: Supplies
Alias de parte #: 7100306861
Peso unitario: 431 g
Productos encontrados:
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Atributos seleccionados: 0

CNHTS:
3919109900
USHTS:
4811412100
JPHTS:
481141000
KRHTS:
4811410000
MXHTS:
4811410100
BRHTS:
48114190
ECCN:
EAR99

9703 Series Electrically Conductive Adhesive Tapes

3M™ 9703 Series 1510-001G-011 Electrically Conductive Adhesive Transfer Tapes feature adhesive-coated liners for a more conformable and flexible double-sided tape. These transfer tapes offer Z-axis-based conductivity in a variety of conductive adhesives, carriers, and fillers to provide enhanced EMI performance. The adhesive transfer tapes electrically connect and mechanically bond medium-pitch flexible circuits with other flexible circuits (flex), rigid printed circuit boards (PCB), or LCD screens. The electrically conductive adhesive transfer tapes are available in multiple thicknesses and provide EMI/RFI shielding and grounding across various frequencies.

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.