170814-2016

Molex
538-170814-2016
170814-2016

Fabr.:

Descripción:
Conectores placa a placa y mezzanine NeoScale Recpt 6x12 8mm Hght

Hoja de datos:
Modelo ECAD:
Descargue el Cargador de bibliotecas gratuito para convertir este archivo para su herramienta ECAD. Obtenga más información del modelo ECAD.
Más información
Más información sobre Molex 170814-2016

Disponibilidad

Existencias:
No en almacén
Plazo de producción de fábrica:
Mínimo: 360   Múltiples: 72
Precio unitario:
-,-- €
Precio total:
-,-- €
Tarifa estimada:
Este producto se envía de forma GRATUITA

Precio (EUR)

Cant. Precio unitario
Precio total
46,31 € 16.671,60 €

Atributo del producto Valor del atributo Seleccionar atributo
Molex
Categoría de producto: Conectores placa a placa y mezzanine
RoHS:  
Connectors
72 Position
2.8 mm (0.11 in)
6 Row
Straight
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
170814
Marca: Molex
Inflamabilidad máxima: UL 94 V-0
Estilo de montaje: Cable
Tipo de producto: Board to Board & Mezzanine Connectors
Cantidad del paquete de fábrica: 24
Subcategoría: Board to Board & Mezzanine Connectors
Nombre comercial: NeoScale
Alias de parte #: 1708142016 01708142016
Productos encontrados:
Para mostrar productos similares, seleccione al menos una casilla
Seleccione al menos una casilla para mostrar productos similares dentro de esta categoría.
Atributos seleccionados: 0

Hoja de datos

Models

TARIC:
8536693000
CNHTS:
8536690000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Board-to-Board Connectors

Molex Board-to-Board Connectors are available in a variety of configurations, offering an expansive array of pitches and stacking heights. The printed circuit board (PCB) is a foundational staple in the electronics industry, and with continuing trends toward miniaturization, designers need a more diverse range of solutions for creating dependable PCB connections. To fit a range of applications, Molex Board-to-Board Connectors include mezzanine, backplane, coplanar, and more. These connectors are ideal for microminiature and high-power applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

NeoScale High-Speed Mezzanine System

Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.

Se ha producido un error inesperado.


¿Tiene alguna pregunta? Visite el Centro de Ayuda.
Si tiene alguna pregunta acerca de un pedido específico, inicie sesión en su cuenta.

Si tiene más problemas, póngase en contacto con nosotros llamando al 800-346-6873 o envíe un correo electrónico a help@mouser.com.