FS3L25R12W2H3B11BPSA1
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726-FS3L25R12W2H3B11
FS3L25R12W2H3B11BPSA1
Fabr.:
Descripción:
Módulos IGBT 1200 V, 25 A 3-level IGBT module
Módulos IGBT 1200 V, 25 A 3-level IGBT module
Hoja de datos:
Disponibilidad
-
Existencias:
-
No en almacénSe ha producido un error inesperado. Intente de nuevo más tarde.
-
Plazo de producción de fábrica:
-
10 Semanas Tiempo estimado para la producción en fábrica.
Precio (EUR)
| Cant. | Precio unitario |
Precio total
|
|---|---|---|
| 44,08 € | 44,08 € | |
| 32,89 € | 328,90 € |
Hoja de datos
Application Notes
- Aging stability of various heatconducting pastes for use with modules without baseplates (PDF)
- Application of screen print templates to paste thermal grease within IGBT modules (PDF)
- Assembly Instructions - Easy-PressFIT Modules (PDF)
- Deadtime calculation for IGBT Modules (PDF)
- Driving IGBTs with unipolar gate voltage (PDF)
- Industrial IGBT Modules Explanation of Technical Information (PDF)
- Transient Thermal Measurements and thermal equivalent circuit models (PDF)
- Using the NTC inside a power module (PDF)
Other
Product Catalogs
- 3-Level Inverter Modules (PDF)
- Easy & Econo Power Modules (PDF)
- Easy B-series and Easy750 Power modules (PDF)
- Infineon's Latest Power and Sensing Guide (PDF)
- Modules for Photovoltaic String and Multi-String Inverters (PDF)
- PressFIT - Our established, reliable mounting technology (PDF)
- Solutions for Industrial Drives (PDF)
- Solutions for Uninterruptible Power Supply (UPS) Systems (PDF)
Technical Resources
- Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules (PDF)
- Impact of module parasitics on the performance of fast-switching devices (PDF)
- PressFIT Technology, a Solderless Method for Mounting Power Modules (PDF)
- Reliability of PressFIT connections (PDF)
- The challenge of accurately analyzing thermal resistances (PDF)
- Thermal Heat Sink Interface of IGBT Modules w/o Base Plate (PDF)
Test/Quality Data
- TARIC:
- 8541290000
- USHTS:
- 8541290065
- ECCN:
- EAR99
