10163418-0B11002LF

Amphenol FCI
649-01634180B11002LF
10163418-0B11002LF

Fabr.:

Descripción:
Conectores placa a placa y mezzanine BERGSTAK .5MM

Ciclo de vida:
Nuevo producto:
Novedad de este fabricante.
Modelo ECAD:
Descargue el Cargador de bibliotecas gratuito para convertir este archivo para su herramienta ECAD. Obtenga más información del modelo ECAD.

En existencias: 431

Existencias:
431 Puede enviarse inmediatamente
Plazo de producción de fábrica:
10 Semanas Tiempo estimado para la producción en fábrica para cantidades superiores a las mostradas.
Mínimo: 1   Múltiples: 1
Precio unitario:
-,-- €
Precio total:
-,-- €
Tarifa estimada:

Precio (EUR)

Cant. Precio unitario
Precio total
3,05 € 3,05 €
2,78 € 27,80 €
2,62 € 65,50 €
2,56 € 128,00 €
2,44 € 244,00 €
2,14 € 535,00 €
2,08 € 1.040,00 €
Bobina completo(s) (realice el pedido en múltiplos de 1000)
2,02 € 2.020,00 €

Atributo del producto Valor del atributo Seleccionar atributo
Amphenol
Categoría de producto: Conectores placa a placa y mezzanine
Headers
120 Position
2 Row
Solder
Vertical
500 mA
100 V
- 55 C
+ 125 C
Gold
Copper
Liquid Crystal Polymer (LCP)
BergStak HS
Reel
Cut Tape
Marca: Amphenol FCI
Inflamabilidad máxima: UL 94 V-0
Resistencia de aislamiento: 100 MOhms
Estilo de montaje: PCB Mount
Tipo de producto: Board to Board & Mezzanine Connectors
Cantidad del paquete de fábrica: 1000
Subcategoría: Board to Board & Mezzanine Connectors
Productos encontrados:
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Atributos seleccionados: 0

TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

BergStak HS™ 0.5mm Mezzanine Connectors

Amphenol FCI BergStak HS™ 0.5mm Mezzanine Connectors are designed for high-speed and high-density parallel board-to-board applications and come in a variety of heights in different sizes. These connectors provide a flexible solution to meet 25Gbps and 32Gbps performance requirements. Additional features include scoop-proof housing, multiple plating, and PCB locator pegs. The series supports high-speed applications from PCIe® Gen 3, PCIe Gen 4, and PCIe Gen 5. Amphenol FCI BergStak HS™ 0.5mm Mezzanine Connectors are ideally used in datacom, telecom, server, storage, and embedded computer.

Bergstak® Board-to-Board Connectors

Amphenol FCI Bergstak® Board-to-Board Connectors are designed for industrial, telecom, datacom, automotive, and medical applications. These Bergstak connectors from Amphenol FCI offer micro-pitches from 0.40mm to 0.80mm, connector position options from 10 to 200, and stack height flexibility from 3mm to 20mm. The wide-ranging product line is suited to fit a variety of application requirements.

BergStak® 0.5mm Pitch Connectors

Amphenol FCI BergStak® 0.5mm Pitch Connectors deliver a comprehensive, versatile solution for high-density applications. The series includes stack heights of 3mm to 6mm in 0.5mm increments with 10 to 80 positions and 7mm to 8.5mm in 0.5mm increments with 10 to 100 positions. The connectors feature a scoop-proof housing and a unique design that ensures the terminals are not damaged during mating. Amphenol FCI BergStak 0.5mm Pitch Connectors are suitable for high-density and parallel board stacking applications, including point-of-sale (POS) equipment, surveillance cameras, medical devices, measurement equipment, and more.